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  US5U38 transistor 1/5 2.5v drive pch+sbd mosfet US5U38 z structure silicon p-channel mosfet schottky barrier diode z features 1) the US5U38 combines pch mosfet with a schottky barrier diode in a tumt5 package. 2) low on-resistance with fast switching. 3) low voltage drive (2.5v). 4) built-in schottky barrier diode has low forward voltage. z applications switching z packaging specifications US5U38 tr 3000 type package code taping basic ordering unit (pieces) z absolute maximum ratings (ta=25 c) v rm v r i f i fsm tj parameter v v dss symbol ? 20 v v gss 12 a i d 1.0 a i dp 4.0 a i s ? 0.4 a i sp ? 4.0 v 20 a 0.7 a 3.0 c 150 c tch 150 v 25 limits unit channel temperature w / element p d 0.7 power dissipation w / total p d 1.0 c tstg ? 55 to +150 power dissipation range of storage temperature drain-source voltage gate-source voltage drain current continuous pulsed continuous pulsed source current (body diode) repetitive peak reverse voltage reverse voltage forward current forward current surge peak junction temperature ? 1 ? 1 ? 3 ? 2 w / element p d 0.5 power dissipation ? 3 ? 3 ? 1 pw 10 s, duty cycle 1% ? 2 60hz 1cyc. ? 3 mounted on a ceramic board z dimension s ( unit : mm ) tumt5 abbreviated symbol : u38 2.0 1.3 0.2max. (1)gate (2)source (3)anode (4)cathode (5)drain ? 1 esd protection diode ? 2 body diode ? 2 ? 1 (1) (2) (5) (3) (4) z e q uivalent circuit
US5U38 transistor 2/5 z electrical characteristics (ta=25 c) parameter symbol i gss y fs av gs = 12v, v ds =0v v dd ? 15 v v dd ? 15 v unit conditions v (br) dss vi d = ? 1ma, v gs =0v i dss av ds = ? 20v, v gs =0v v gs (th) vv ds = ? 10v, i d = ? 1ma m ? i d = ? 1a, v gs = ? 4.5v r ds (on) m ? i d = ? 1a, v gs = ? 4.0v m ? i d = ? 0.5a, v gs = ? 2.5v sv ds = ? 10v, i d = ? 0.5a c iss pf v ds = ? 10v c oss pf v gs =0v c rss pf f=1mhz t d (on) ns i d = ? 0.5a t r ns t d (off) ns v gs = ? 4.5v t f ns r l 30 ? q g nc r g =10 ? r l 15 ? , r g =10 ? q gs ? typ. ? ? ? 280 310 570 ? 150 20 20 9 8 25 10 2.1 0.5 0.5 nc v gs = ? 4.5v q gd min. ? ? 20 ? ? 0.7 ? ? ? 0.7 ? ? ? ? ? ? ? ? ? ? 10 max. ? ? 1 ? 2.0 390 430 800 ? ? ? ? ? ? ? ? ? ? ? nc i d = ? 1a, ? ? ? ? ? ? ? ? ? gate-source leakage drain-source breakdown voltage zero gate voltage drain current gate threshold voltage static drain-source on-state resistance forward transfer admittance input capacitance output capacitance reverse transfer capacitance turn-on delay time rise time turn-off delay time fall time total gate charge gate-source charge gate-drain charge ? pulsed < mosfet > v sd ??? 1.2 v i s = ? 0.4a, v gs =0v forward voltage parameter symbol min. typ. max. unit conditions < body diode (source ? drain) > v f ?? 0.49 v i f =0.7a i r ?? 200 av r =20v reverse current forward voltage parameter symbol min. typ. max. unit conditions < di >
US5U38 transistor 3/5 z electrical characteristic curves fig.1 typical transfer characteristics 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 0.001 0.1 1 0.01 10 gate ? source voltage : -v gs [ v ] drain current : ? i d (a) v ds = ? 10v pulsed ta = 125 c 75 c 25 c ? 25 c fig.2 static drain ? source on ? state resistance vs.drain current ( ) 0.01 0.1 1 100 1000 10000 10 drain current : ? i d [ a ] static drain ? source on ? state resistance : r ds ( on )[ m ?] v gs = ? 4.5v pulsed ta = 125 c 75 c 25 c ? 25 c fig.3 static drain ? source on ? state resistance vs.drain current ( ? ) drain current : ? i d [ a ] static drain ? source on ? state resistance : r ds ( on )[ m ?] 0.01 0.1 1 100 1000 10000 10 v gs = ? 4v pulsed ta = 125 c 75 c 25 c ? 25 c fig.4 static drain ? source on ? state resistance vs.drain ? current ( ?? ) 0.01 0.1 1 100 1000 10000 10 drain current : ? i d [ a ] static drain ? source on ? state resistance : r ds ( on )[ m ?] v gs = ? 2.5v pulsed ta = 125 c 75 c 25 c ? 25 c 10 012 8 4 26 0 250 500 750 1000 static drain ? source on ? state resistance gate ? source voltage : ? v gs [ v ] fig.5 static drain ? source on ? state resistance vs.gate ? source voltage : r ds ( on ) [m ? ] ta=25 c pulsed i d= ? 0 . 5a ? 1a fig.6 static drain ? source on ? state resistance vs.drain current 0.01 0.1 1 100 1000 10000 10 drain current : ? i d [ a ] static drain-source on ? state resistance : r ds ( on )[ m ?] v gs = ? 2 . 5v ? 4 . 0v ? 4 . 5v ta=25 c pulsed 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 source ? drain voltage : ? v sd [ v ] fig.7 reverse drain current vs. source-drain current 0.01 reverse drain current : ? i s [ a ] 0.1 10 1 v gs =0v pulsed ta = 125 c 75 c 25 c ? 25 c 0.01 0.1 1 10 100 drain ? source voltage : ? v ds [ v ] fig.8 typical capactitance vs.drain ? source voltage 10 100 1000 capacitance : c [ pf ] c iss c oss c rss ta=25 c f=1mhz v gs =0v 0.01 0.1 1 10 drain current : ? i d [ a ] fig.9 switching characteristics 1 10 1000 10000 100 switching time : t [ ns ] ta=25 c v dd = ? 15v v gs = ? 4.5v r g =10 ? pulsed t d ( off ) t d ( on ) t r t f
US5U38 transistor 4/5 fig.10 dynamic input characteristics 0 0.5 1 1.5 2 2.5 3 0 4 total gate charge : qg [ nc ] gate-source voltage: -v gs [ v ] 1 2 3 5 ta=25 c v dd = ? 15v i d = ? 1a r g =10 ? pulsed z notice 1. sbd has a large reverse leak current compared to other type of diode. therefore; it would raise a junction temperature, and increase a reverse power loss. further rise of inside temperature would cause a thermal runaway. this built-in sbd has low v f characteristics and therefore, higher leak current. please consider enough the surrounding temperature, generating heat of mosfet and the reverse current. 2. this product might cause chip aging and breakdown under the large electrified environment. please consider to design esd protection circuit. 0.01 0.1 1 10 100 1000 10000 100000 0 5 10 15 20 25 reverse voltage : vr [v] reverse current : ir [ua] pulsed ta= - 25 ta = 25 ta = 125 ta = 75 fig.11 reverse current vs. reverse voltage 0.001 0.01 0.1 1 0 0.1 0.2 0.3 0.4 0.5 0.6 pulsed ta= - 25 ta = 25 ta = 125 ta = 75 fig.12 forward current vs. forward voltage forw ard voltage : v f (v) forward current : i f (a)
US5U38 transistor 5/5 z measurement circuits fig.13 switching time measurement circuit v gs r g v ds d.u.t. i d r l v dd 90% 10% 90% 10% 10% v gs v ds 90% t f t off t d(off) t r t on t d(on) fig.14 switching waveforms 50% 50% pulse width fig.15 gate charge measurement circuit v gs r g v ds d.u.t. i d r l v dd i g (const) fig.16 gate charge waveforms v gs qg qgs qgd v g charge
notes no technical content pages of this document may be reproduced in any form or transmitted by any means without prior permission of rohm co.,ltd. the contents described herein are subject to change without notice. the specifications for the product described in this document are for reference only. upon actual use, therefore, please request that specifications to be separately delivered. application circuit diagrams and circuit constants contained herein are shown as examples of standard use and operation. please pay careful attention to the peripheral conditions when designing circuits and deciding upon circuit constants in the set. any data, including, but not limited to application circuit diagrams information, described herein are intended only as illustrations of such devices and not as the specifications for such devices. rohm co.,ltd. disclaims any warranty that any use of such devices shall be free from infringement of any third party's intellectual property rights or other proprietary rights, and further, assumes no liability of whatsoever nature in the event of any such infringement, or arising from or connected with or related to the use of such devices. upon the sale of any such devices, other than for buyer's right to use such devices itself, resell or otherwise dispose of the same, no express or implied right or license to practice or commercially exploit any intellectual property rights or other proprietary rights owned or controlled by rohm co., ltd. is granted to any such buyer. products listed in this document are no antiradiation design. appendix1-rev2.0 thank you for your accessing to rohm product informations. more detail product informations and catalogs are available, please contact your nearest sales office. rohm customer support system the americas / europe / asia / japan contact us : webmaster@ rohm.co. jp www.rohm.com copyright ? 2008 rohm co.,ltd. the products listed in this document are designed to be used with ordinary electronic equipment or de vices (such as audio visual equipment, office-automation equipment, communications devices, electrical appliances and electronic toys). should you intend to use these products with equipment or devices which require an extremely high level of reliability and the malfunction of which would directly endanger human life (such as medical instruments, transportation equipment, aerospace machinery, nuclear-reactor controllers, fuel controllers and other safety devices), please be sure to consult with our sales representative in advance. it is our top priority to supply products with the utmost quality and reliability. however, there is always a chance of failure due to unexpected factors. therefore, please take into account the derating characteristics and allow for sufficient safety features, such as extra margin, anti-flammability, and fail-safe measures when designing in order to prevent possible accidents that may result in bodily harm or fire caused by component failure. rohm cannot be held responsible for any damages arising from the use of the products under conditions out of the range of the specifications or due to non-compliance with the notes specified in this catalog. 21 saiin mizosaki- cho, ukyo-ku, kyoto 615-8585, japan tel : +81-75-311-2121 fax : +81-75-315-0172 appendix


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